Dedicated Air Servo Type Wafer Thickness Messuring System.
Characteristics
- Non-contact measurement using air.
- Can measure glass other than wafers (must be more than 700 μm thick).
- Wafer-only measurement part available as an option.
- Measuring range: 8.5mm long stroke.
- Measurement using manual movement between one center point and four perimeter points.
- Measurement data can be sent to a PC (option).
- Easy switching to 8-inch setup by changing a pin position.